Boyd Corporation has over 90 years of customer success and is a worldwide leader in advanced solutions that cool, seal, and protect disruptive technologies. The Internet of Things (IoT) has proliferated advanced compute technology across all industries with applications exponentially becoming more complex. Users want devices smaller, faster, and lighter with greater functionality. More smart functionality operating faster in tighter spaces means greater power density, more heat, and greater electrical challenges. Additionally, people use devices in unpredictable environments with harsh conditions. Devices must be waterproof, dustproof, insulated and able to withstand great shock and vibration. eMobility batteries, power inverters, and autonomous compute electronics create excessive exhaust heat that must be cooled to maintain safe operating temperatures. Battery, power and compute enclosures have to be sealed against water and road vibration to prevent early failure. 5G telecommunication towers, cloud compute, data centers, and connected devices create, process, and store more data so fast that traditional cooling technologies can’t keep up, driving thermal technology roadmap innovation. From humble beginnings as an industrial fabricator in the Bay Area of California in 1928; Boyd has evolved into a dynamic global innovator of high performance, integrated solutions.